4

LP3875-ADJ

SNVS247E – SEPTEMBER 2003 – REVISED AUGUST 2016

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Copyright © 2003–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

(3)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.

(4)

The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get

forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically

withstand 200 mA of DC current and 1 A of peak current.

(5)

At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heat sink values (if a

heat sink is used). If power dissipation causes the junction temperature to exceed specified limits, the device goes into thermal

shutdown.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

IN pin to GND pin voltage

−0.3

7.5

V

Shutdown (SD) pin to GND pin voltage

−0.3

7.5

V

OUT pin to GND pin voltage(3),(4)

−0.3

6

V

IOUT

Short-circuit protected

Power dissipation(5)

Internally limited

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VIN supply voltage

(1)

2.5

7

V

Shutdown (SD) voltage

−0.3

7

V

Maximum operating current (DC) IOUT

1.5

A

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

6.4 Thermal Information

THERMAL METRIC(1)

LP3875-ADJ

UNIT

NDC (SOT-223)

KTT (TO-263)

5 PINS

5 PINS

RθJA

(2)

Junction-to-ambient thermal resistance, High K

65.2

40.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

47.2

43.4

°C/W

RθJB

Junction-to-board thermal resistance

9.9

23.1

°C/W

ψJT

Junction-to-top characterization parameter

3.4

11.5

°C/W

ψJB

Junction-to-board characterization parameter

9.7

22

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

1

°C/W