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LP3875-ADJ

SNVS247E – SEPTEMBER 2003 – REVISED AUGUST 2016

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Copyright © 2003–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings ............................................................ 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 7

7

Detailed Description .............................................. 8

7.1

Overview ................................................................... 8

7.2

Functional Block Diagram ......................................... 8

7.3

Feature Description................................................... 8

7.4

Device Functional Modes.......................................... 8

8

Application and Implementation .......................... 9

8.1

Application Information.............................................. 9

8.2

Typical Application .................................................... 9

9

Power Supply Recommendations ...................... 15

10

Layout................................................................... 15

10.1

Layout Guidelines ................................................. 15

10.2

Layout Examples................................................... 15

11

Device and Documentation Support ................. 17

11.1

Related Documentation ....................................... 17

11.2

Receiving Notification of Documentation Updates 17

11.3

Community Resources.......................................... 17

11.4

Trademarks ........................................................... 17

11.5

Electrostatic Discharge Caution ............................ 17

11.6

Glossary ................................................................ 17

12

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (April 2013) to Revision E

Page

•

Added Device Information table, Pin Configuration and Functions section, ESD Ratings and Thermal Information

tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power

Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ..................................................................................................................... 1

•

Changed "Linear Regulator" in title and text of page 1 to "LDO" ........................................................................................... 1

•

Deleted all information re: TO-220 package, which is obsolete. ........................................................................................... 1

•

Changed all VIN and VOUT pin names to IN and OUT in drawings and text........................................................................ 1

•

Deleted "(survival)" from Abs Max rows ................................................................................................................................ 4

•

Changed Changed RθJA values: SOT-223 package from "90°C/W" to "65.2°C/W, DDPAK/TO-263 package from

"60°C/W" to "40.3°C/W".......................................................................................................................................................... 4

•

Added updated Thermal Values table and footnotes ............................................................................................................. 4

•

Deleted all "Heatsinking" subsections as they have out-of-date information; added Power Dissipation and Estimating

Junction Temperature .......................................................................................................................................................... 12

Changes from Revision C (April 2013) to Revision D

Page

•

Changed layout of National Semiconductor data sheet to TI format.................................................................................... 15