R6JA=

TJ - TA

Power

R6=



T

Power

LM2830, LM2830-Q1

SNVS454E – AUGUST 2006 – REVISED DECEMBER 2014

www.ti.com

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Thermal Definitions

TJ

Chip junction temperature

TA

Ambient temperature

RθJC

Thermal resistance from chip junction to device case

RθJA

Thermal resistance from chip junction to ambient air

Heat in the LM2830 device due to internal power dissipation is removed through conduction and/or convection.

Conduction: Heat transfer occurs through cross sectional areas of material. Depending on the material, the

transfer of heat can be considered to have poor to good thermal conductivity properties (insulator

vs. conductor).

Heat Transfer goes as:

Silicon

→ package → lead frame → PCB

Convection: Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural

convection occurs when air currents rise from the hot device to cooler air.

Thermal impedance is defined as:

(39)

Thermal impedance from the silicon junction to the ambient air is defined as:

(40)

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 9. Related Links

TECHNICAL

TOOLS &

SUPPORT &

PARTS

PRODUCT FOLDER

SAMPLE & BUY

DOCUMENTS

SOFTWARE

COMMUNITY

LM2830

Click here

Click here

Click here

Click here

Click here

LM2830-Q1

Click here

Click here

Click here

Click here

Click here

11.3 Trademarks

All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

28

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Product Folder Links: LM2830 LM2830-Q1