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DRV8828 датащи(PDF) 18 Page - Texas Instruments

номер детали DRV8828
подробное описание детали  DRV8828 H-Bridge Motor Controller IC
PDF  27 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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DRV8828 датащи(HTML) 18 Page - Texas Instruments

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2
TOT
DS(on )
(RMS)
P
2 R
IOUT
=
´
´
DRV8828
SLVSA11G – OCTOBER 2009 – REVISED NOVEMBER 2015
www.ti.com
10.3 Power Dissipation
Power dissipation in the DRV8828 is dominated by the power dissipated in the output FET resistance, or
RDS(on). Average power dissipation when running a brushed DC motor can be roughly estimated by Equation 3.
(3)
Where:
•
PTOT is the total power dissipation
•
RDS(on) is the resistance of each FET (high-side and low-side)
•
IOUT(RMS) is the RMS output current being applied to the motor
The maximum amount of power that can be dissipated in the devices is dependent on ambient temperature and
heatsinking. RDS(on) increases with temperature, so as the device heats, the power dissipation increases. This
must be taken into consideration when sizing the heatsink.
10.4 Heatsinking
The PowerPAD™ package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, refer to TI application report SLMA002, PowerPAD™ Thermally
Enhanced Package and TI application brief SLMA004, PowerPAD™ Made Easy, available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
10.4.1 Thermal Information
The DRV8828 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately
150°C, the device will be disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high an ambient temperature.
18
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Product Folder Links: DRV8828



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