AIN3

AIN4

AIN5

AIN6

AIN7

SCLK

DOUT

DIN

TM_BUSY

CS

ThermalPad

1

2

3

4

5

15

14

13

12

11

ADS8028

www.ti.com

SBAS549B – MAY 2011 – REVISED MARCH 2012

PIN CONFIGURATIONS

RTJ PACKAGE(1)

QFN-20

(TOP VIEW)

(1) The exposed thermal pad on the bottom of the package must be soldered to the printed circuit board (PCB) ground for proper

functionality and heat dissipation.

NOTE: NC = no connection.

PIN ASSIGNMENTS

NAME

PIN

FUNCTION

DESCRIPTION

AGND

6

Supply

Analog ground

AIN0

18

Analog input

Analog input channel 0

AIN1

19

Analog input

Analog input channel 1

AIN2

20

Analog input

Analog input channel 2

AIN3

1

Analog input

Analog input channel 3

AIN4

2

Analog input

Analog input channel 4

AIN5

3

Analog input

Analog input channel 5

AIN6

4

Analog input

Analog input channel 6

AIN7

5

Analog input

Analog input channel 7

AVDD

10

Supply

ADC operation supply voltage

CS

11

Digital input

Chip select; active low logic input

DGND

9

Supply

Digital ground

DIN

13

Digital input

SPI data input

DOUT

14

Digital output

SPI data output

DVDD

16

Supply

ADC interface supply voltage

This pin has no internal connection. Any passive component connected to this

NC

8

—

pin does not affect device functionality.

PD/RST

17

Digital input

Dual function pin for power-down and reset operation; active low logic input

REF

7

Analog input/output

ADC internal reference output or ADC external reference input

SCLK

15

Digital input

SPI clock

Exposed thermal pad; this pin should be soldered to the PCB ground for proper

Thermal pad

—

Thermal pad

functionality and heat dissipation

Busy output; this pin transitions high and remains high during conversion for

TM_BUSY

12

Digital input

temperature sensor input

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