4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6

V

IIK (2)

Input clamp current

(VI < 0 V or VI > VCC)

±20

mA

IOK (2)

Output clamp current

(VO < 0 V or VO > VCC)

±50

mA

IO

Continuous output current

(VO > 0 V or VO < VCC)

±50

mA

Continuous current through VCC or GND

±100

mA

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

4.2 ESD Ratings

VALUE

UNIT

V (ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

TA = 25°C

-55°C to 125°C

-40°C to 85°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VCC

Supply voltage

4.5

5.5

4.5

5.5

4.5

5.5

V

VIH

High-level input voltage

2

2

2

V

VIL

Low-level input voltage

0.8

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

0

VCC

V

VO

Output voltage

0

VCC

0

VCC

0

VCC

V

IOH

High-level output current

‐24

‐24

-24

mA

IOL

Low-level output current

24

24

24

mA

Δt/Δv

Input transition rise or fall rate

10

10

10

ns/V

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

4.4 Thermal Information

THERMAL METRIC(1)

CD74ACT157

UNIT

D (SOIC)

N

(PDIP)

PW

(TSSOP)

16

R θJA

Junction-to-ambient thermal resistance

119.9

67

145.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD74ACT157

SCHS340C – MARCH 2003 – REVISED AUGUST 2024

www.ti.com

4

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