HIP2101

FN9025 Rev.10.00

Page 2 of 15

Aug 8, 2019

Ordering Information

PART NUMBER

(Notes 2, 3)

TEMP.

RANGE (°C)

TAPE AND REEL

(Units) (Note 1)

PACKAGE

(RoHS Compliant)

PKG.

DWG. #

HIP2101IBZ

-40 to 125

-

8 Ld SOIC

M8.15

HIP2101IBZT

-40 to 125

2.5k

8 Ld SOIC

M8.15

HIP2101IBZT7A

-40 to 125

250

8 Ld SOIC

M8.15

HIP2101EIBZ

-40 to 125

-

8 Ld EPSOIC

M8.15C

HIP2101EIBZT

-40 to 125

2.5k

8 Ld EPSOIC

M8.15C

HIP2101IRZ

-40 to 125

-

16 Ld 5x5 QFN

L16.5x5

HIP2101IRZT

-40 to 125

6k

16 Ld 5x5 QFN

L16.5x5

HIP2101IR4Z

-40 to 125

-

12 Ld 4x4 DFN

L12.4x4A

HIP2101IR4ZT

-40 to 125

6k

12 Ld 4x4 DFN

L12.4x4A

NOTES:

1. See TB347 for details about reel specifications.

2. Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which

are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020C.

3. For Moisture Sensitivity Level (MSL), see the HIP2101 device page. For more information about MSL, see TB363.

Pinouts

HIP2101 (SOIC, EPSOIC)

TOP VIEW

HIP2101IR4 (DFN)

TOP VIEW

HIP2101 (QFN)

TOP VIEW

NOTE: EPAD = Exposed PAD.

5

6

8

7

4

3

2

1

VDD

HB

HO

HS

LO

LI

HI

VSS

EPAD

VDD

NC

NC

HB

HO

LO

VSS

NC

NC

LI

HS

HI

2

3

4

1

5

11

10

9

12

8

6

7

EPAD

1

3

4

15

HB

HO

16

14

13

2

12

10

9

11

6

57

8

VSS

LI

NC

NC

NC

NC

EPAD

Pin Descriptions

SYMBOL

DESCRIPTION

VDD

Positive Supply to lower gate drivers. De-couple this pin to VSS. Bootstrap diode connected to HB.

HB

High-Side Bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.

Bootstrap diode is on-chip.

HO

High-Side Output. Connect to gate of High-Side power MOSFET.

HS

High-Side Source connection. Connect to source of High-Side power MOSFET. Connect negative side of bootstrap capacitor to

this pin.

HI

High-Side input.

LI

Low-Side input.

VSS

Chip negative supply, generally will be ground.

LO

Low-Side Output. Connect to gate of Low-Side power MOSFET.

EPAD

Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.