PTH12020x

(T o p V i ew)

1

2

10 9 8

7

6

5

4

3

GND

GND

L

O

A

D

Track

Margin Down

Margin Up

VIN

Inhibit

VOUT

VO Sense

RSET

+

CIN

560 mF

(Required)

+ C

OUT

330 mF

(Optional)

ABSOLUTE MAXIMUM RATINGS

PTH12020W/L

SLTS208I – MAY 2003 – REVISED MARCH 2009 ............................................................................................................................................................. www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

STANDARD APPLICATION

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com

over operating free-air temperature range unless otherwise noted

(1)

UNIT

Vtrack

Track input

–0.3V to VI +0.3 V

TA

Operating temperature

Over VI Range

–40C to 85C

range

PTH12020WAH

Surface temperature of module body or pins

Twave

Wave solder temperature

260°C (2)

(5 seconds maximum)

PTH12020WAD

PTH12020WAS

235°C (2)

Treflow

Solder reflow temperature

Surface temperature of module body or pins

PTH12020WAZ

260°C (2)

Tstg

Storage temperature

Storage temperature of module removed from shipping package

–55°C to 125°C

Tpkg

Packaging temperature

Shipping Tray or Tape and Reel storage or bake temperature

45°C

Mechanical shock

Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted

500 G

Mechanical vibration

Mil-STD-883D, Method 2007.2 20-2000 Hz

20 G

Weight

7 grams

Flammability

Meets UL 94V-O

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated

maximum.

2

Submit Documentation Feedback

Copyright © 2003–2009, Texas Instruments Incorporated

Product Folder Link(s) :PTH12020W/L