LP38869

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SNVS877B – AUGUST 2012 – REVISED APRIL 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN to GND (Survival)

-0.3V to 6.0V

All other inputs to GND

-0.3V to 6.0V

Power Dissipation (Survival)

Internally Limited

IOUT (Survival)

Internally Limited

ESD Rating(3),Human Body Model

2 kV

Storage Temperature Range

-65°C to +150°C

Junction Temperature

150°C

Peak Reflow Temperature (4)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. Test method is per JESD22-A114.

(4)

Peak Reflow Temperatures for Surface Mount devices are defined in Absolute Maximum Ratings for Soldering (literature number

SNOA549).

Operating Ratings

(1)

VIN Voltage

2.7V to 5.5V

VSHDN Voltage

0V to 5.5V

VRST Voltage

0V to VIN

Junction Temperature (TJ)

(2)

−40°C to +125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD),

maximum allowable operating junction temperature (TJ(MAX)), and package thermal resistance (θJA). See Operating Region and Power

Dissipation.

Electrical Characteristics

Unless otherwise specified: VIN = VOUT(NOM) + 500 mV, VSHDN = VIN, IOUT = 10 mA, CIN = 1 μF MLCC, COUT = 1 μF MLCC, SS =

Open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of

-40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values

represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

VIN

Input Voltage Operating Range

2.7

-

5.5

V

VIN Rising or Falling

UVLO

Input Under-Voltage Lock-Out

2.27

2.45

2.58

V

Includes Hysteresis

ΔUVLO

UVLO Hysteresis

-

64

-

mV

3.0V

≤ VIN ≤ 5.5V,

-0.50

-

0.50

Output Voltage Accuracy

IOUT = 1 mA, TJ = 25°C

VOUT

%

(Pre-Set Mode)

IOUT = 1 mA

-0.75

-

0.75

Regulated Feedback Voltage

VREF

IOUT = 150 mA

794

800

806

mV

(Adjustable Mode)

ΔVOUT(LINE)

Line Regulation (1)

ΔVIN = 3.0 to 5.5V

-

0.0011

-

%/V

ΔVOUT(LOAD)

Load Regulation (2)

ΔIOUT = 1 mA to 1A

-

0.2

1.85

%/A

(1)

Line Regulation is the % change in VOUT from VOUT(NOM) for every 1V change in VIN,Line Regulation = (( ΔVOUT / VOUT(NOM)) / ΔVIN ) x

100%

(2)

Load Regulation is the % change in VOUT from VOUT(NOM) for every 1A change in IOUT, Load Regulation = (( ΔVOUT / VOUT(NOM) ) /

ΔIOUT ) x 100%

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