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LP38869MHX/NOPB датащи(PDF) 2 Page - Texas Instruments |
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LP38869MHX/NOPB датащи(HTML) 2 Page - Texas Instruments |
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2 / 27 page ![]() IN IN N/C OUT SET GND IN SS N/C IN OUT OUT OUT N/C 1 2 3 4 8 7 6 5 9 10 11 12 13 14 15 16 Exposed Pad on Bottom (DAP) RST SHDN LP38869 SNVS877B – AUGUST 2012 – REVISED APRIL 2013 www.ti.com Connection Diagram Figure 1. Top View 16-Pin HTSSOP Pin Descriptions for 16-Pin HTSSOP Packages Pin # Pin Name Description Application Information 1 N/C No Connection No Internal Electrical Connection Operates from +2.7V to +5.5V. Bypass capacitor is required, located close to the 2, 3, 4, 5 IN Positive power input package; 1 μF is recommended as a minimum value Open-drain output is low when VOUT is 8% below normal regulation voltage. If 6 RST RESET Output regulation returns RST remains low for at least 3ms afterwards. Use large value pull-up resistor (100 k Ω) to VOUT to obtain output voltage. A logic low state on the SHDN input will turn the regulator off, and will discharge 7 SHDN SHUTDOWN Input any capacitor on the SS pin. A logic high on the SHDN pin will turn the regulator ON. 8 SS Soft-Start control Connect a capacitor from SS to GND. If SS is left open SS feature is disabled 9 N/C No Connection No Internal Electrical Connection 10 GND Power Ground Return connection for input and output voltages. Used to select between Pre-Set Mode or Adjustable Mode. Connect to ground 11 SET Operational Mode Selection (Pre-Set Mode) or to a resistor divider from VOUT to SET pin to GND (Adjustable Mode). 12, 13, Regulated output voltage. A bypass capacitor is required, located close to the OUT Regulated output 14, 15 package; 1 μF recommended as the minimum value 16 N/C No Connection No Internal Electrical Connection Solder the DAP to a copper plane under the package to improve thermal Exposed performance. DAP can be connected to ground at device Pin 10. Optionally, but DAP Thermal Connection Pad not recommended, the DAP can be left floating. Do not connect DAP to any potential other than ground. See Operating Region and Power Dissipation. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LP38869 |
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