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FPD03784 датащи(PDF) 7 Page - National Semiconductor (TI) |
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FPD03784 датащи(HTML) 7 Page - National Semiconductor (TI) |
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7 / 12 page ![]() Functional Description (Continued) the effect of redistributing the charge stored in the capaci- tance of the panel columns. Since half the columns are at voltages more positive than V com and half are more nega- tive, this redistribution of charge or “charge-sharing” has the effect of pulling all of the columns to a neutral voltage near the middle of the driver’s dynamic range. Thus, the voltages on all the columns are driven approximately halfway toward their next value with no power expended. This dramatically reduces panel power dissipation (up to a theoretical limit of 50%) compared to conventional drivers which must drive each column through the entire voltage swing every time polarity is reversed. PIN DESCRIPTIONS The pin order configuration for the FPD03784 is shown in fig. 3. Optional pins do not need to be carried off a custom TCP or COP package but may require a connection to a neigh- boring pad on the die by a tie on the tape. The following paragraphs describe the function of the FPD03784 pins. CSTIME — CHARGE SHARE TIME (INPUT) The input controls how long the outputs are in charge share mode following each LOAD signal. The CSTIME input from all of the column drivers should be tied together and con- nected to VSS1 through a parallel combination of RC. The charge time is determined by the equation: T charge share = 0.69 RC A typical capacitance of 100pF should be chosen to swamp parasitic board and I/O pin effects. See Figure 1. CLK — DATA CLOCK (INPUT) Clock input for data on Dx[0:5]. DX[5:0] — DATA BUS (INPUT) DA[5:0] — Data Input Pins for OUTPUTS 1, 7...379 DB[5:0] — Data Input Pins for OUTPUTS 2, 8...380 DC[5:0] — Data Input Pins for OUTPUTS 3, 9...381 DD[5:0] — Data Input Pins for OUTPUTS 4, 10...382 DE[5:0] — Data Input Pins for OUTPUTS 5, 11...383 DF[5:0] — Data Input Pins for OUTPUTS 6, 12...384 ENIO1/ENIO2 — DATA LOADING ENABLE 1 AND 2 (I/O) If UP = H, then the ENIO1 pin is configured as an input and the ENIO2 pin is configured as an output. If UP = L, then the ENIO2 pin is configured as an input and the ENIO1 pin is configured as an output. INVTABC — DIGITAL DATA INVERT (INPUT) When INVERT = L, input data from DA[0:5], DB[0:5] and DC[0:5] is inverted. The INVTABC pin can be tied to INVTDEF on the TCP to form a single INVERT pin, or operated independently from each other. INVTDEF — DIGITAL DATA INVERT (INPUT) When INVERT = H, input data from DD[0:5], DE[0:5] and DF[0:5] is inverted. The INVTABC pin can be tied to INVTDEF on the TCP to form a single INVERT pin, or operated independently from each other. I REF — REFERENCE CURRENT FOR OUTPUT DRIVE (INPUT) The I REF input allows the designer to set the maximum output drive current (I MAX) of the FPD03784 suitable for the column line, RC network load. Current flow out of the I REF pin is used to set the rise and fall slew rate of the output waveform. This current is supplied through an external re- sistor (R IREF) tied between the I REF pin (held by the FPD03784 at V DD1) and VSS1. Each driver IC must have a separate R IREF resistor (see Figure 1). I SIN — CURRENT SOURCE INPUT (INPUT) The I SIN current controls the bandwidth and settling perfor- mance of the FPD03784 output-stage amplifiers. Increasing I SIN increases the amplifier bandwidth and reduces settling time but also increases power consumption. Normally, I SIN is set to 40µA, which provides a good balance between power consumption and amplifier bandwidth. The flexibility to adjust I SIN accommodates very fast rise times (ISIN > 40µA) or applications where low power is of extreme interest (I SIN < 40µA). The I SIN current is supplied through an external resistor (R ISIN) connected between the ISIN pin and VDD2.RISIN can be computed as follows: (ISIN normally = 40µA) One resistor (R ISIN) is needed for the entire display. This resistor is connected to the I SIN input of the first driver, and the current going into this pin is copied to the I SOUT output pin for cascading to the next driver. See Figure 1. Note that I HBIAS varies linearly with ISIN. I SOUT — CURRENT SOURCE OUTPUT (OUTPUT) This output pin supplies the I SIN current to the ISIN input pin of the next driver in the row (see Figure 1). The I SOUT pin of the last driver should be left floating. Optionally, this pin can be left floating on each driver if the designer wishes to provide a separate I SIN source to each driver. While this adds resistor component count, it reduces input lead count. LOAD — DATA LOAD (INPUT) The falling edge of LOAD copies the digital video buffered by the shift register into a second latch beginning the D to A conversion. Immediately following the fall of LOAD, the out- puts are forced into charge share mode for the time set by the CSTIME input. The outputs then drive the D to A con- verted voltages following the CSTIME. POL — POLARITY (INPUT) When POL = L, odd numbered outputs (1, 3, 5, ...383) are controlled by VGMA7 through VGMA12 and even numbered outputs are controlled by VGMA1 through VGMA6. When POL = H, odd numbered outputs are controlled by VGMA1 through VGMA6 and even numbered outputs are controlled by VGMA7 through VGMA12. SINGLE — SINGLE/DUAL-EDGE CLOCK ENABLE (IN- PUT) This pin controls single/dual-edge clocking. When SINGLE is high, single-edge clocking is enabled, and input data is latched only on the falling edge of CLK. When SINGLE is low, dual-edge clocking is enabled, and input data is latched on both the rising and falling edges of CLK. Optional — The SINGLE die pad is bounded on each side by a logic High and a logic Low pad. This allows the state of SINGLE to be chosen on the TCP to eliminate an input pin. UP — DATA SHIFT DIRECTION — UP OR DOWN (INPUT) The UP pin controls the data shift direction. If UP is high then data is shifted “up” from output 1 to output 384, ENIO1 is configured as an input, and ENIO2 is an output. If UP is low then data is shifted “down” from output 384 to output 1, ENIO2 is an input, and ENIO1 is an output. www.national.com 7 |
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