LM75B, LM75C

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SNIS153D – JULY 2009 – REVISED OCTOBER 2015

9 Power Supply Recommendations

The LM75 is specified for operation from 2.7 V to 5.5 V. Place a 100-nF and 10-µF capacitor close to +Vs in

order to reduce errors coupling in from noisy or high impedance supplies.

10 Layout

10.1 Layout Guidelines

To achieve the expected results when measuring temperature with an integrated circuit temperature sensor like

the LM75, it is important to understand that the sensor measures its own die temperature. For the LM75, the best

thermal path between the die and the outside world is through the LM75's pins. In the VSSOP package for the

LM75B and LM75C, the GND pin is directly connected to the die, so the GND pin provides the best thermal path.

If the other pins are at different temperatures (unlikely, but possible), they will affect the die temperature, but not

as strongly as the GND pin. In the SOIC package, none of the pins is directly connected to the die, so they will

all contribute similarly to the die temperature. Because the pins represent a good thermal path to the LM75 die,

the LM75 will provide an accurate measurement of the temperature of the printed circuit board on which it is

mounted. There is a less efficient thermal path between the plastic package and the LM75 die. If the ambient air

temperature is significantly different from the printed circuit board temperature, it will have a small effect on the

measured temperature.

In probe-type applications, the LM75 can be mounted inside a sealed-end metal tube, and can then be dipped

into a bath or screwed into a threaded hole in a tank. As with any IC, the LM75 and accompanying wiring and

circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may

operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as

Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM75 or its

connections.

10.1.1 Digital Noise Issues

The LM75B features an integrated low-pass filter on both the SCL and the SDA digital lines to mitigate the

effects of bus noise. Although this filtering makes the LM75B communication robust in noisy environments, good

layout practices are always recommended. Minimize noise coupling by keeping digital traces away from

switching power supplies. Also, ensure that digital lines containing high-speed data communications cross at

right angles to the SDA and SCL lines.

Excessive noise coupling into the SDA and SCL lines on the LM75C-specifically noise with amplitude greater

than 400 mVpp (the LM75’s typical hysteresis), overshoot greater than 300 mV above +Vs, and undershoot more

than 300 mV below GND-may prevent successful serial communication with the LM75C. Serial bus no-

acknowledge is the most common symptom, causing unnecessary traffic on the bus. The layout procedures

mentioned above apply also to the LM75C. Although the serial bus maximum frequency of communication is only

400 kHz, care must be taken to ensure proper termination within a system with long printed circuit board traces

or multiple parts on the bus. Resistance can be added in series with the SDA and SCL lines to further help filter

noise and ringing. A 5 k

Ω resistor should be placed in series with the SCL line, placed as close as possible to the

SCL pin on the LM75C. This 5 k

Ω resistor, with the 5 pF to 10 pF stray capacitance of the LM75 provides a 6

MHz to 12 MHz low pass filter, which is sufficient filtering in most cases.

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Product Folder Links: LM75B LM75C