CSD18501Q5A

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SLPS319C – JUNE 2012 – REVISED JANUARY 2015

5 Specifications

5.1 Electrical Characteristics

(TA = 25°C unless otherwise stated)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

STATIC CHARACTERISTICS

BVDSS

Drain-to-Source Voltage

VGS = 0 V, ID = 250 μA

40

V

IDSS

Drain-to-Source Leakage Current

VGS = 0 V, VDS = 32 V

1

μA

IGSS

Gate-to-Source Leakage Current

VDS = 0 V, VGS = 20 V

100

nA

VGS(th)

Gate-to-Source Threshold Voltage

VDS = VGS, ID = 250 μA

1.4

1.8

2.3

V

VGS = 4.5 V, ID = 25 A

3.3

4.3

m

Ω

RDS(on)

Drain-to-Source On-Resistance

VGS = 10 V, ID = 25 A

2.5

3.2

m

Ω

gƒs

Transconductance

VDS = 20 V, ID = 25 A

118

S

DYNAMIC CHARACTERISTICS

Ciss

Input Capacitance

3200

3840

pF

VGS = 0 V, VDS = 20 V,

Coss

Output Capacitance

725

870

pF

ƒ = 1 MHz

Crss

Reverse Transfer Capacitance

18

23

pF

RG

Series Gate Resistance

1.2

2.4

Ω

Qg

Gate Charge Total (4.5 V)

20

24

nC

Qg

Gate Charge Total (10 V)

42

50

Qgd

Gate Charge Gate-to-Drain

VDS = 20 V, ID = 25 A

5.9

nC

Qgs

Gate Charge Gate-to-Source

8.1

nC

Qg(th)

Gate Charge at Vth

5.7

nC

Qoss

Output Charge

VDS = 20 V, VGS = 0 V

48

nC

td(on)

Turn On Delay Time

4.7

ns

tr

Rise Time

10

ns

VDS = 20 V, VGS = 10 V,

IDS = 25 A, RG = 0

td(off)

Turn Off Delay Time

20

ns

tƒ

Fall Time

3.4

ns

DIODE CHARACTERISTICS

VSD

Diode Forward Voltage

IDS = 25 A, VGS = 0 V

0.8

1

V

Qrr

Reverse Recovery Charge

70

nC

VDS= 20 V, IF = 25 A, di/dt = 300 A/μs

trr

Reverse Recovery Time

40

ns

5.2 Thermal Information

(TA = 25°C unless otherwise stated)

THERMAL METRIC

MIN

TYP

MAX

UNIT

RθJC

Junction-to-Case Thermal Resistance(1)

1.0

°C/W

RθJA

Junction-to-Ambient Thermal Resistance(1)(2)

50

(1)

RθJC is determined with the device mounted on a 1-inch

2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inches × 1.5-inches

(3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board

design.

(2)

Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.

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