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PACKAGE OUTLINE

C

(4.7)

2.62 MAX

8X 1.27

(7.02)

2X 5.08

10X

0.48

0.38

0.16

0.10

0.85

0.67

22.7 MAX

(4.3)

(6.62)

B

7.06

6.66

A

7.27

6.77

(6.248)

(6.248)

CFP - 2.63mm max height

HKU0010A

CERAMIC DUAL FLATPACK

4226200/A 09/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This package is hermetically sealed with a metal lid.

4. The terminals are gold plated.

5. This drawing does not comply with MIL STD 1835. Do not use this package for compliant product.

6. Metal lid is connected to back side pad metalization.

1

10

5

6

PIN 1 ID

0.2

C A

B

METAL LID

PIN 1 ID

1

10

5

6

BACK SIDE PAD

METALIZATION

(THERMAL PAD)