THS8136

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SLES236B – NOVEMBER 2008 – REVISED APRIL 2013

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

AVDD to AVSS

–0.5 V to 3.6 V

Supply voltage

DVDD to DVSS

–0.5 V to 1.95 V

AVSS to DVSS

–0.5 to 0.5 V

Digital input voltage range to DVSS

–0.5 V to (DVDD + 0.5) V

TA

Operating free-air temperature range

–40°C to 85°C

Tstg

Storage temperature range

–55°C to 150°C

Human-body model (HBM)(3), All pins

>2000 V

VESD

ESD stress voltage(2)

Charged-device model (CDM)(4), All pins

>500 V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.

(3)

Level listed is the passing level per ANSI/ESDA/JEDEC JS-001-2010 and AEC Q100-002 rev D. JEDEC document JEP155 states that

500-V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500-V HBM is possible if

necessary precautions are taken. Pins listed as 2000 V may actually have higher performance.

(4)

Level listed is the passing level per EIA-JEDEC JESD22-C101E and AEC Q100-011 rev B. JEDEC document JEP157 states that 250-V

CDM allows safe manufacturing with a standard ESD control process. Pins listed as 500 V may actually have higher performance.

Corner pins meet the AEC Q100-011 rev B 750-V requirement.

THERMAL SPECIFICATIONS

PARAMETER

TEST CONDITIONS(1)

MIN

TYP

MAX

UNIT

Thermal PAD soldered to 4-layer High-K

29.11

°C/W

PCB

θJA

Junction-to-ambient thermal resistance, still air

Low-K PCB, Thermal PAD not soldered

64.42

°C/W

θJC

Junction-to-case thermal resistance, still air

0.12

Maximum junction temperature for reliable

TJ(MAX)

105

°C

operation

(1)

When split ground planes are used, attach the thermal pad to the analog ground plane.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Power Supply

AVDD

3

3.3

3.6

V

DVDD

1.65

1.8

1.95

V

Digital and Reference Inputs

VIH

High-level input voltage

1.2

DVDD

V

VIL

Low-level input voltage

DVSS

0.7

V

fCLK

Clock frequency

0

180

MHz

CLK

tw(CLKH)

Pulse duration, clock high

40%

60%

period

CLK

tw(CLKL)

Pulse duration, clock low

40%

60%

period

RFS(nom)

FSADJ resistor(1)

3.8

k

Ω

(1)

RFS should be chosen such that the maximum full-scale DAC output current (IFS) does not exceed the maximum stated level. This yields

the nominal output voltage compliance at the nominal load termination of 37.5

Ω.

Copyright © 2008–2013, Texas Instruments Incorporated

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