PCM1740

2

SBAS128B

www.ti.com

PIN

NAME

I/O

FUNCTION

1

XT1

—

27MHz Crystal connection.

2

PGND

—

PLL and VCXO ground.

3

XTUN

IN

VCXO tune, tuning voltage range from 0V to 3V.

4VPP

—

PLL and VCXO power supply, +5V.

5

MCKO

OUT

Buffered clock output of VCXO.

6

AD0

IN

Device address pin for I2C-BUS.(1)

7

AD1

IN

Device address pin for I2C-BUS.(1)

8

SCL

IN

Bit clock input for I2C-BUS interface.

9SDA

IN/OUT Serial data for I2C-BUS interface.

10

RST

IN

Reset, active LOW.(2)

11

VOUTR

OUT

Right-channel analog voltage output.

12

AGND

—

Analog ground.

13

VCC

—

Analog power supply, +5V.

14

VOUTL

OUT

Left-channel analog voltage output.

15

VCOM

—

DC common-mode voltage output.

16

ZERO

OUT

Zero flag output, active LOW.(3)

17

BCK

IN

Bit clock input for serial audio data.(1)

18

DATA

IN

Serial audio data input.(1)

19

LRCK

IN

Left and right word clock, equal to the sampling

rate (fS).(1)

20

RSV

—

Reserved must be open.

21

SCKO

OUT

System clock output, 256/384 fS.

22

VDD

—

Digital power supply, +5V.

23

DGND

—

Digital ground.

24

XT2

—

27MHz Crystal connection.

NOTES: (1) Schmitt trigger input.

(2) Schmitt trigger input with internal pull-up resistor.

(3) Open drain output.

Power Supply Voltage(2) ................................................................... +6.5V

Supply Voltage Differences(3) ...........................................................

±0.1V

GND Voltage Differences(4) ..............................................................

±0.1V

Digital Input Voltage ................................................. –0.3V to (VDD + 0.3V)

Analog Input Voltage ................................................ –0.3V to (VCC + 0.3V)

Input Current (any pins except supplies) ........................................

±10mA

Operating Temperature Range ......................................... –25

°C to +85°C

Storage Temperature ...................................................... –55

°C to +125°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 5s) .................................................. +260

°C

Package Temperature (IR reflow, peak, 10s) ................................ +235

°C

NOTES: (1) Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability. (2) VCC, VDD, VPP.

(3) Among VCC, VDD, VPP. (4) Among AGND, DGND, and PGND.

PIN ASSIGNMENTS

PIN CONFIGURATION

Top View

SSOP

ABSOLUTE MAXIMUM RATINGS(1)

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause

damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA

PCM1740E

SSOP-24

DB

–25

°C to +85°C

PCM1740E

PCM1740E

Rails, 58

"

"

"

"

PCM1740E

PCM1740E/2K

Tape and Reel, 2000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com.

PACKAGE/ORDERING INFORMATION(1)

XT1

PGND

XTUN

V

PP

MCKO

AD0

AD1

SCL

SDA

RST

V

OUTR

AGND

PCM1740

XT2

DGND

V

DD

SCKO

RSV

LRCK

DATA

BCK

ZERO

V

COM

V

OUTL

V

CC

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13