4

LP5524

SNVS500C – JULY 2007 – REVISED NOVEMBER 2016

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Copyright © 2007–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

For detailed soldering specifications and information, refer to AN-1112 DSBGA Wafer Level Chip Scale Package and Absolute

Maximum Ratings for Soldering.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typical) and

disengages at TJ=140°C (typical).

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3) (4)

MIN

MAX

UNIT

V (VIN, DX, ISET)

–0.3

6

V

Voltage on logic pins (ENA, ENB)

–0.3

6

V

Continuous power dissipation(5)

Internally limited

Junction temperature, TJ-MAX

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage on power pin (VIN)

2.7

5.5

V

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

(1)

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

6.4 Thermal Information

THERMAL METRIC(1)

LP5524

UNIT

YFQ (DSBGA)

9 PINS

RθJA

Junction-to-ambient thermal resistance(2)

101.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.9

°C/W

RθJB

Junction-to-board thermal resistance

22.7

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

22.7

°C/W