2

LP5524

SNVS500C – JULY 2007 – REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LP5524

Submit Documentation Feedback

Copyright © 2007–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

LED Driver Typical Characteristics ........................... 6

7

Detailed Description .............................................. 7

7.1

Overview ................................................................... 7

7.2

Functional Block Diagram ......................................... 7

7.3

Feature Description................................................... 7

7.4

Device Functional Modes.......................................... 8

8

Application and Implementation .......................... 9

8.1

Application Information.............................................. 9

8.2

Typical Application ................................................... 9

9

Power Supply Recommendations ...................... 11

10

Layout................................................................... 12

10.1

Layout Guidelines ................................................. 12

10.2

Layout Example .................................................... 12

11

Device and Documentation Support ................. 13

11.1

Documentation Support ........................................ 13

11.2

Receiving Notification of Documentation Updates 13

11.3

Community Resources.......................................... 13

11.4

Trademarks ........................................................... 13

11.5

Electrostatic Discharge Caution ............................ 13

11.6

Glossary ................................................................ 13

12

Mechanical, Packaging, and Orderable

Information ........................................................... 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (June 2016) to Revision C

Page

•

Changed wording of data sheet title ...................................................................................................................................... 1

Changes from Revision A (May 2013) to Revision B

Page

•

Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description,

Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and

Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1

•

Deleted lead temperature and soldering rows from Abs Max table - information in POA ..................................................... 4

•

Added Thermal Information table with revised RθJA value (from "80 - 125°C/W" to "101.9°C/W") and added

additional thermal values. ...................................................................................................................................................... 4

Changes from Original (April 2013) to Revision A

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 10