4

LP3991

SNVS296J – DECEMBER 2006 – REVISED JUNE 2016

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Copyright © 2006–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

IN, OUT pins, voltage to GND

–0.3

6.5

V

EN pin, voltage to GND

–0.3

(VIN + 0.3) < 6.5

V

Junction temperature

150

°C

Continuous power dissipation(4)

Internally Limited

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

(1)

The maximum ambient temperature (TA-MAX) is a suggested value dependant on the maximum operating junction temperature (TJ-MAX-

OP) = 125°C); the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of

the part / package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

1.65

4

V

Recommended load current

300

mA

Junction temperature

–40

125

°C

Ambient temperature, TA

(1)

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

6.4 Thermal Information

THERMAL METRIC(1)

LP3991

UNIT

YZR (DSBGA)

4 PINS

RθJA

(2)

Junction-to-ambient thermal resistance, High K

189.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.5

°C/W

RθJB

Junction-to-board thermal resistance

112.9

°C/W

ψJT

Junction-to-top characterization parameter

8.7

°C/W

ψJB

Junction-to-board characterization parameter

112.8

°C/W