LP3992

SNVS192C – OCTOBER 2002 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Input voltage

–0.3

6.5

V

Output voltage

–0.3 to (VIN + 0.3)

6.5

V

Shutdown input voltage

–0.3

6.5

V

Maximum power dissipation

568

mW

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input voltage

1.9

5.2

V

Shutdown input voltage

0

6

V

Junction temperature

–40

125

°C

Power dissipation at 25°C

454

mW

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For ensured

performance limits and associated test conditions, see Electrical Characteristics.

6.4 Thermal Information

LP3992

THERMAL METRIC(1)

DBV (SOT-23)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

170.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

124.4

°C/W

RθJB

Junction-to-board thermal resistance

30.9

°C/W

ψJT

Junction-to-top characterization parameter

17.6

°C/W

ψJB

Junction-to-board characterization parameter

30.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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