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L6728 датащи(PDF) 30 Page - STMicroelectronics |
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L6728 датащи(HTML) 30 Page - STMicroelectronics |
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30 / 32 page ![]() Mechanical data and package dimensions L6728 30/32 14 Mechanical data and package dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 18. Mechanical data and package dimensions DIMENSIONS REF. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 0.80 0.90 1.00 0.031 0.035 0.039 A1 0.02 0.05 0.001 0.002 A2 0.70 0.028 A3 0.20 0.008 b 0.18 0.23 0.30 0.007 0.009 0.012 D 3.00 0.118 D2 2.21 2.26 2.31 0.087 0.089 0.091 E 3.00 0.118 E2 1.49 1.64 1.74 0.059 0.065 0.069 e0.50 0.20 L 0.3 0.4 0.5 0.012 0.016 0.020 PACKAGE AND PACKING INFORMATION DFN10 (3x3) Weight: not available DUAL FLAT NO-LEAD PACKAGE M m 0.75 0.295 0.25 0.098 |
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