Data Sheet

AD8488

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Voltage

Supply (AVDD, DVDD)

5.5 V

Charge Input IN0 to IN127

−0.3 V to VREF + 0.3 V

Reference (VREF, VREF_ESD)

5.5 V

Logic Inputs

−0.3 V to +5.5 V

Maximum Junction Temperature

125°C

Storage Temperature Range

−30°C to +150°C

Input Charge to Integrator Channels

20 pC

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this

specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

THERMAL DATA

ΨJB is the junction-to-board thermal characterization parameter

with a unit of °C/W. The ΨJB of the package is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through

multiple thermal paths rather than a single path, as in thermal

resistance, θJB. Therefore, ΨJB thermal paths include convection

from the top of the package as well as radiation from the package,

factors that make ΨJB more useful in real-world applications.

Maximum junction temperature (TJ) is calculated from the board

temperature (TB) and power dissipation (PD) using the formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL CHARACTERIZATION

Table 3. Thermal Resistance—Normal Operation (1.4 W)

Airflow Velocity

(m/sec)

Ambient

θJA

ΨJT

ΨJB

θJC

Unit

0

85°C

18.6

0.20

8.3

4.4

°C/W

50°C

19.7

0.17

8.3

4.4

°C/W

25°C

20.6

0.16

8.3

4.4

°C/W

1

85°C

15.8

0.32

8.2

4.4

°C/W

50°C

16.1

0.30

8.2

4.4

°C/W

25°C

16.4

0.29

8.2

4.4

°C/W

3

85°C

13.8

0.54

7.7

4.4

°C/W

50°C

14.0

0.53

7.7

4.4

°C/W

25°C

14.2

0.52

7.7

4.4

°C/W

Table 4. Thermal Resistance—Low Power Operation (0.5 W)

Airflow Velocity

(m/sec)

Ambient

θJA

ΨJT

ΨJB

θJC

Unit

0

85°C

19.0

0.19

8.3

4.4

°C/W

50°C

20.2

0.16

8.3

4.4

°C/W

25°C

21.2

0.15

8.3

4.4

°C/W

1

85°C

15.7

0.31

8.1

4.4

°C/W

50°C

16.2

0.29

8.1

4.4

°C/W

25°C

16.4

0.28

8.1

4.4

°C/W

3

85°C

13.8

0.54

7.8

4.4

°C/W

50°C

14.1

0.52

7.8

4.4

°C/W

25°C

14.2

0.51

7.8

4.4

°C/W

Note that the thermal numbers are simulated per JEDEC JESD51-9

on a 4-layer printed circuit board size = 101.5 mm × 114.5 mm.

ESD CAUTION