DSP56303 datasheet(27/292 Pages) FREESCALE

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Power

DSP56303 User’s Manual, Rev. 2

Freescale Semiconductor

2-3

2.1 Power

2.2 Ground

Table 2-2. Power Inputs

Power Name

Description

VCCP

PLL Power

VCC dedicated for use with Phase Lock Loop (PLL). The voltage should be well-regulated and the input

should be provided with an extremely low impedance path to the VCC power rail.

VCCQ (4)

Quiet Power

An isolated power for the internal processing logic. This input must be tied externally to all other chip

power inputs, except for VCCP. The user must provide adequate external decoupling capacitors.

VCCA (4)

Address Bus Power

An isolated power for sections of the address bus I/O drivers. This input must be tied externally to all other

chip power inputs, except for VCCP. The user must provide adequate external decoupling capacitors.

VCCD (4)

Data Bus Power

An isolated power for sections of the data bus I/O drivers. This input must be tied externally to all other

chip power inputs, except for VCCP. The user must provide adequate external decoupling capacitors.

VCCC (2)

Bus Control Power

An isolated power for the bus control I/O drivers. This input must be tied externally to all other chip power

inputs, except for VCCP. The user must provide adequate external decoupling capacitors.

VCCH

Host Power

An isolated power for the HI08 I/O drivers. This input must be tied externally to all other chip power inputs,

except for VCCP. The user must provide adequate external decoupling capacitors.

VCCS (2)

ESSI, SCI, and Timer Power

An isolated power for the ESSI, SCI, and timer I/O drivers. This input must be tied externally to all other

chip power inputs, except for VCCP. The user must provide adequate external decoupling capacitors.

Note:

These designations are package-dependent. Some packages connect all VCC inputs except VCCP to each other

internally. On those packages, all power input except VCCP are labeled VCC. The numbers of connections indicated

in this table are minimum values; the total VCC connections are package-dependent.

Table 2-3. Grounds

Ground Name

Description

GNDP

PLL Ground

Ground dedicated for PLL use. The connection should be provided with an extremely low-impedance

path to ground. VCCP should be bypassed to GNDP by a 0.47 µF capacitor located as close as possible

to the chip package.

GNDP1

PLL Ground 1

Ground dedicated for PLL use. The connection should be provided with an extremely low-impedance

path to ground.

GNDQ (4)

Quiet Ground

An isolated ground for the internal processing logic. This connection must be tied externally to all other

chip ground connections, except GNDP and GNDP1. The user must provide adequate external

decoupling capacitors.

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