Advanced Low Power Schottky Logic - 74ALS174

Hex D-type Flip-Flop in bare die form



High speed – 2ns (Min) propagation delay



Direct drop-in replacement for obsolete

components in long term programs.

Rev 1.1

20/01/24

Features:

Ordering Information

The 74ALS174 Hex D-type Flip-Flop is fabricated using a

2µm 40V Bipolar process. The device is comprised of six

flip-flops each having independent data input and data

output. Load and clear is simultaneous, triggered by

common clock and master reset respectively. D-Input

levels transfer to Q output with the positive clock pulse.

Description

Die Dimensions in µm (mils)

The following part suffixes apply:

2100 (83)



No suffix - MIL-STD-883 /2010B Visual Inspection

For High Reliability versions of this product please see

Die Size (Unsawn)

2100 x 1800

83 x 71

µm

mils

Minimum Bond Pad Size

130 x 130

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

54ALS174

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

Page 1 of 5

www.siliconsupplies.com