High Speed CMOS Logic – 54HC393

 

Dual 4-bit negative edge triggered binary ripple counter in bare die form

Rev 1.0

7/5/2019

Features:

 

 

Low Input Current: 1µA

Output Drive Capability: 10 LSTTL loads

Outputs Directly Interface to CMOS, NMOS, & TTL

Operating Voltage Range: 2V to 6V

CMOS High Noise Immunity

Function compatible with 54LS393

 

 

 

 

Full Military Temperature Range.

 

 

 

 

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

The 54HC393 consists of x2 independent 4–bit binary

ripple counters with parallel outputs from each counter

stage. A ÷ 256 counter can be produced by cascading

the two binary counters. Internal flip–flops trigger by

high–to–low transitions of the clock input. Reset for the

counters is asynchronous & active–high. State

changes of the Q outputs do not occur simultaneously

because of internal ripple delays. Therefore, decoded

output signals are subject to decoding spikes & should

not be used as clocks or as strobes except when gated

with the Clock of the HC393.

Description

Die Dimensions in µm (mils)

 

 

 

 

 

 

 

 

 

 

 

 

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Die Size (Unsawn)

1650 x 1800

65 x 70

µm

mils

Minimum Bond Pad Size

106 x 106

4.17 x 4.17

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

1650 (65)

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

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