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M24C64-R датащи(PDF) 36 Page - STMicroelectronics

номер детали M24C64-R
подробное описание детали  64-Kbit serial I²C bus EEPROM
PDF  54 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24C64-R датащи(HTML) 36 Page - STMicroelectronics

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Package information
M24C64-W M24C64-R M24C64-F M24C64-DF
36/54
DS6638 Rev 36
9.2
UFDFPN8 (DFN8) package information
Figure 20. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch
dual flat package, no lead - package outline
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating
(not connected) in the end application.
Table 22. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,
no lead - package mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Min
Typ
Max
Min
Typ
Max
A
0.450
0.550
0.600
0.0177
0.0217
0.0236
A1
0.000
0.020
0.050
0.0000
0.0008
0.0020
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
D
1.900
2.000
2.100
0.0748
0.0787
0.0827
D2
1.200
-
1.600
0.0472
-
0.0630
E
2.900
3.000
3.100
0.1142
0.1181
0.1220
E2
1.200
-
1.600
0.0472
-
0.0630
e
-
0.500
-
-
0.0197
-
K
0.300
-
-
0.0118
-
-
L
0.300
-
0.500
0.0118
-
0.0197
L1
-
-
0.150
-
-
0.0059
L3
0.300
-
-
0.0118
-
-
eee(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.080
-
-
0.0031
-
-



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