FM24CL16

Rev 3.3

Nov. 2005

Page 13 of 13

Revision History

Revision

Date

Summary

1.0

2/15/01

Initial Release.

1.1

9/29/01

Endurance changed to unlimited.

2.0

2/22/02

Changed to Production status. Added clarification to package standard and

changed package name to SOIC.

2.1

3/24/03

Added “green” packaging option.

2.2

6/24/04

Changed storage temp range -55 to +125 C. Removed Data Retention note.

3.0

7/14/04

3.1

11/19/04

Added DFN package ordering option and added mechanical drawing. Added

pcb footprint drawings. Increased Idd @ 1MHz to 450uA.

3.2

3/8/05

Changed Data Retention spec.

Added ESD and package MSL ratings.

Removed “preliminary” from DFN package drawing.

3.3

11/28/05

Changed package name from DFN to TDFN. Fixed formatting of notes in DC