6

Figure 9a. Recommended SnPb Reflow Soldering Profile.

Figure 10. Recommended Wave Soldering Profile.

Figure 8a. Recommended Soldering Pad Pattern.

240°C MAX.

20 SEC. MAX.

3°C/SEC.

MAX.

120 SEC. MAX.

TIME

183°C

100-150°C

–6°C/SEC.

MAX.

60-150 SEC.

3°C/SEC. MAX.

Figure 8b. Recommended Soldering Pad Pattern (TTW).

Thermal Resistance

Solder Pad Area (xy)

300

°C/W

350

°C/W

470

°C/W

Figure 9b. Recommended Pb-free Reflow Soldering Profile.

Note: For detailed information on reflow soldering of Avago surface

mount LEDs, refer to Avago Application Note AN 1060 Surface

Mounting SMT LED Indicator Components.

217 °C

MAX. 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

125 °C ± 25 °C

255 °C

60 to 150 SEC.

10 to 20 SEC.

TIME

* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.

+5 °C

-0 °C

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

010

20

30

50

100

150

200

250

30

40

50

TIME – SECONDS

60

70

80

90

100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150

°C (100°C PCB)

SOLDER WAVE TEMPERATURE = 245

°C

AIR KNIFE AIR TEMPERATURE = 390

°C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

°

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED

BEFORE EXERTING MECHANICAL FORCE.

2.60

(0.103)

SOLDER RESIST

REPRESENTS ELECTRICAL

CONNECTIVITY BETWEEN PADS

4.50 (0.178)

Y

X

0.40 (0.016)

X

0.50

(0.020)

Y

1.10

(0.043)

1.50 (0.059)

DIMENSIONS IN mm (INCHES).

X

X

0.5 (0.020)

Y

Y

1.0 (0.039)

2.0 (0.079)

2.0 (0.079)

6.0 (0.236)

3.0 (0.118)

2.8 (0.110)

6.1 (0.240)

DIMENSIONS IN mm (INCHES).

REPRESENTS ELECTRICAL

CONNECTIVITY BETWEEN PADS