5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

VS

Supply voltage, VS = (VS+) – (VS–)

–0.3

13

V

I1 or I2 to VCM

–5.5

5.5

V

I1, I2, and VCM

Voltage

(VS–) – 0.3

(VS+) + 0.3

V

Current

20

mA

Auxiliary amplifier input voltage

Single-ended

(VS–) – 0.3

(VS+) + 0.3

V

Differential (V+IN) – (V–IN)

–0.3

0.3

Auxiliary amplifier input current

–10

10

mA

Output short-circuit (2)

Continuous

mA

Operating temperature

–40

125

℃

TJ

Junction temperature

–55

150

℃

Tstg

Storage temperature, Tstg

–60

160

℃

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage

4.5

12.6

V

VREFGND

REFGND compliance voltage

(VS–)

(VS+) – 4.5

V

VIBIAS

IBIAS compliance voltage

(VS–)

(VS+) – 1.0

V

IVREF

Output current of REF165 or REF25 reference

–2

5

mA

II2

I2 input current

1

mA

TA

Specified temperature

–40

125

℃

5.4 Thermal Information

THERMAL METRIC (1)

LOG200

UNIT

RGT (VQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

66.7

℃/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.8

℃/W

RθJB

Junction-to-board thermal resistance

39.8

℃/W

ψJT

Junction-to-top characterization parameter

3.8

℃/W

ψJB

Junction-to-board characterization parameter

39.8

℃/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

31.2

℃/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LOG200

SBOSA28A – AUGUST 2023 – REVISED DECEMBER 2024

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