M68ICS08KX datasheet(22/77 Pages) MOTOROLA

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User’s Manual

M68ICS08KX In-Circuit Simulator

Preparation and Installation

MOTOROLA

Preparation and Installation

3. Place the pin tension arm of the KXICS DIP socket XU1 in the down

position to secure the pins of the MCU to the socket.

NOTE:

The top (label side) of the MCU package must be visible when looking at the

component side of the board.

2.2.3.2 SOIC-type MCU

NOTE:

Installation of a SOIC type MCU requires the use of the SOIC-to-DIP adapter

identified in Table 1-1 of this manual.

1. Place the pin tension arm of the KXICS DIP socket XU1 (Figure 2-1)

in the up position.

2. Install the SOIC-to-DIP adapter into the DIP socket XU1 (Figure

2-1). Be sure that the pin 1 orientation of the adapter aligns with the

pin 1 location on the DIP socket (upper left pin of the DIP socket).

CAUTION:

The SOIC-to-DIP adapter may be confusing to install. It must be placed into the

DIP socket, XU1, with the hinged side of the SOIC shell aligned to the bottom

of the KXICS board. This positioning will place the SOIC-type MCU socket pin

1 in the upper left corner of the SOIC socket.

3. Place the pin tension arm of the KXICS DIP socket XU1 in the down

position to secure the pins of the adapter to the socket.

4. Open the hinged access door on the SOIC shell.

5. Install the SOIC-type MCU into the SOIC socket of the adapter. Be

sure that the pin 1 orientation of the silkscreened dot on the MCU

aligns with the pin 1 location on the SOIC socket (upper left pin of

the socket).

6. Close and secure the hinged access door on the SOIC shell.

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