data sheet

Flat Pack

Features:

CERAMIC

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Ceramic Flat Pack Package

(FP)

Amkor Technology is committed to continuing to

service this long established standard industry

package. This surface mount package consists of a

co-fired ceramic base that has leads brazed to

either the top or bottom of the package. The lid for

this package can be either ceramic "frit sealed" or

metal "solder sealed". This package provides a

hermetic environment for the IC inside.

Applications:

This IC package technology allows application and

design engineers to maximize the performance

characteristics of semiconductors (silicon, GaAs and

S.A.W.). These packages enable end products

(pagers, portable audio/video, disc drives, radio,

IF & RF devices/components, telecom) to be

reduced in size and weight. Semiconductor

families such as operational amplifiers, drivers,

optoelectronics, controllers, logic, analog, memory,

comparators and more using BiCMOS, CMOS or

other silicon/GaAs/S.A.W. technologies are well

addressed by the LLCC product family.

The Flat Pack package offers a variety of features

for the semiconductor IC industry and Amkor

provides a platform from prototype-to-production:

• Flexible lead / pin counts

• Variety of body sizes

• Hermetic package

• Exceptional thermal and electrical performance

by design

• Multi-layer, ground / power

• Cavity Up / Cavity down configurations

• Cavity package

DS809

Rev Date: 08’02

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