CQFP датащи(PDF) - Amkor Technology

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CQFP датащи (PDF) - Amkor Technology

CQFP Datasheet PDF - Amkor Technology


номер детали	CQFP

скачать	CQFP скачать

объем файла	332.85 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Ceramic Quad Flat Pack Package

CQFP Datasheet (PDF)

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скачать датащи

CQFP Datasheet PDF - Amkor Technology


номер детали	CQFP

скачать	CQFP Click to download

объем файла	332.85 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Ceramic Quad Flat Pack Package

CQFP датащи (HTML) - Amkor Technology

CQFP Datasheet HTML 1Page - Amkor Technology

Аналогичный номер детали - CQFP

производитель	номер детали	датащи	подробное описание детали
List of Unclassifed Man...	CQF32C1	40Kb / 1P	4 Pin HC-49/US SMD Microprocessor Crystal
Caliber Electronics Inc...	CQF32C1	45Kb / 1P	4 Pin HC-49/US SMD Microprocessor Crystal
List of Unclassifed Man...	CQF32C3	40Kb / 1P	4 Pin HC-49/US SMD Microprocessor Crystal
Caliber Electronics Inc...	CQF32C3	45Kb / 1P	4 Pin HC-49/US SMD Microprocessor Crystal
List of Unclassifed Man...	CQF32C5	40Kb / 1P	4 Pin HC-49/US SMD Microprocessor Crystal

Аналогичное описание - CQFP

производитель	номер детали	датащи	подробное описание детали
NXP Semiconductors	SOT389-1	14Kb / 1P	Plastic Low Profile Quad flat Package 2002 Jun 07
STATS ChipPAC, Ltd.	LQFP	126Kb / 2P	Low Profile Quad Flat Pack
	MQFP	103Kb / 2P	Metric Quad Flat Pack
	MQFP-D	95Kb / 2P	Heat Spreader Metric Quad Flat Pack
	TQFP	92Kb / 2P	Thin Profile Quad Flat Pack
	QFP-SD	527Kb / 2P	Stacked Die Quad Flat Pack
	QFP-EP	117Kb / 2P	Exposed Pad Quad Flat Pack
	QFN	530Kb / 2P	Quad Flat No-Lead Package
Amkor Technology	FLATPACK	490Kb / 1P	Ceramic Flat Pack Package
Amkor Technology	LQFP	656Kb / 2P	Low Profile Quad Flat Pack (LQFP) Packages

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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