Surface Mount Sense Resistors

OARS, OARS-XP, OARSZ Series

Performance Data (AEC-Q200)

OARS1

<R004

R004 to R015

>R015

OARS-XP

<R002

R002 to R007

>R007

TCR (-55 to 125ºC)

ppm/ºC

240

40

40

Thermal Shock

R%

0.75

0.75

0.75

High Temp. Exposure (125ºC)

R%

1.75

0.5

1

Temp. Cycling (-40 to 125ºC)

R%

1

1

0.75

Operational Life

R%

2

1

1

Biased Humidity

R%

0.75

0.5

0.5

Mechanical Shock

R%

1.5

1

1

Vibration

R%

1

1

1

Terminal Strength

Meets JIS-C-6429

Solvent Resistance

Meets MIL-STD-002 Method 215

Solderability

Meets J-STD-002 Method B

Note: Temperature rise data are given here for typical mounting conditions. Actual figures depend on PCB copper weight, mounting pad size, track

width and substrate type. Also, the open air format responds better to forced air cooling than chip format resistors. For values below 5 milliohms

allowance should be made for heat generated in the copper tracks themselves. Application-specific guidance is available on request.

Temperature Derating

0

20

40

60

80

100

120

0

25

50

75

100

125

150

175

Ambient Temperature (Deg C)

Pulse Energy Rating

0

20

40

60

80

100

120

1

10

100

Value (milliohms)

OARS1

OARS-XP

Note: For OARS-1Z the above derating graph may be applied to

the square of the current rating.

Note: This graph relates to single pulses of short duration (≤ 100ms).

Higher energy limits apply for longer pulses and overloads

Hot Spot Temperature Rise

7.6mm x 7.6mm pads, 2 oz copper on FR4, still air

0

50

100

150

200

250

300

25%

50%

75%

100%

Proportion of Rated Power

50 / 25

30 / 15

10 / 5

5 / -

Value in milliohms

OARS1 / OARS-XP

Joint Temperature Rise

7.6mm x 7.6mm pads, 2 oz copper on FR4, still air

0

20

40

60

80

100

25%

50%

75%

100%

Proportion of Rated Power

5 / -

10 / 5

30 / 15

50 / 25

Value in milliohms

OARS1 / OARS-XP

Issue F .09.07