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TZA3014HT датащи(PDF) 2 Page - NXP Semiconductors

номер детали TZA3014HT
подробное описание детали  2.5 Gbits/s postamplifier with level detector
PDF  28 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TZA3014HT датащи(HTML) 2 Page - NXP Semiconductors

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2001 Jun 25
2
Philips Semiconductors
Product specification
2.5 Gbits/s postamplifier with level detector
TZA3014
FEATURES
• Single 3.3 V power supply
• Wideband operation from 50 kHz to 2.5 GHz (typical
value)
• Fully differential
• On-chip DC-offset compensation without external
capacitor
• Interfacing with supplied positive or negative logic
• Positive Emitter Coupled Logic (PECL) or Current-Mode
Logic (CML) compatible data outputs adjustable from
200 to 800 mV (p-p) single-ended
• Power-down capability for unused output or detector
• Rise and fall times of 80 ps (typical value)
• Inverted output possible
• Input level detection circuit for Received Signal Strength
Indicator (RSSI) and Loss Of Signal (LOS),
programmable from 0.4 to 400 mV (p-p) single-ended,
with open-drain comparator output for directly
interfacing positive or negative logic
• Reference voltage for output level and LOS adjustment
• HTQFP32 and HBCC32 plastic packages with exposed
pad
• Mute input.
APPLICATIONS
• Postamplifier for SDH/SONET transponder
• SDH/SONET wavelength converter
• PECL driver
• Fibre channel arbitrated loop
• Signal level detectors
• Swing converter CML 200 mV (p-p) to
PECL 800 mV (p-p)
• 2.5 GHz clock amplification.
GENERAL DESCRIPTION
The TZA3014 is a low gain postamplifier with a LOS
detector and a RSSI designed for use in critical signal path
control applications, such as loop-through or Wavelength
Division Multiplexing (WDM). The signal path is capable of
operating from 50 kHz up to 2.5 GHz.
The TZA3014 can be delivered in HTQFP32 and HBCC32
packages and as bare die.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TZA3014HT
HTQFP32
plastic, heatsink thin quad flat package; 32 leads; body 5
× 5 × 1.0 mm
SOT547-2
TZA3014VH
HBCC32
plastic, heatsink bottom chip carrier; 32 terminals; body 5
× 5 × 0.65 mm
SOT560-1
TZA3014U
−
bare die; 2.22
× 2.22 × 0.28 mm
−



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