MCP6G01-ESLASHMS datasheet(5/38 Pages) MICROCHIP

5 / 38 page

DS22004B-page 5

MCP6G01/1R/1U/2/3/4

FIGURE 1-1:

Gain Select Timing Diagram.

GSEL High to Valid Output Time,

G = +10 to +50 Select

tGSH10

—

—µs

VIN = 30 mV,

GSEL = 0.75VDD to VOUT = 1.38V

GSEL Low to Valid Output Time,

G = +50 to +10 Select

tGSL50

—

—µs

VIN = 30 mV,

GSEL = 0.25VDD to VOUT = 0.42V

DIGITAL ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, TA = 25°C, VDD = +1.8V to +5.5V, VSS = GND, G = +1 V/V, VIN = (0.3V)/G,

RL = 100 kΩ to VDD/2, CL = 60 pF, GSEL = VDD/2, and CS is tied low.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

GSEL is a tri-level input pin. The gain is 10 when its voltage is low, 1 when it is at mid-suppy, and 50 when it is high.

Not tested in production. Set by design and characterization.

ISS_SHDN includes the current through the CS pin, RL and RLAD, and excludes digital switching currents. The block dia-

gram on the from page shows these current paths (through VSS).

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, and VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

–40

—

+125

°C

Operating Temperature Range

–40

—

+125

°C

(Note 1)

Storage Temperature Range

–65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SOT-23

θJA

—

256

—

°C/W

Thermal Resistance, 8L-SOIC

θJA

—

163

—

°C/W

Thermal Resistance, 8L-MSOP

θJA

—

206

—

°C/W

Thermal Resistance, 14L-SOIC

θJA

—

120

—

°C/W

Thermal Resistance, 14L-TSSOP

θJA

—

100

—

°C/W

Note 1:

The MCP6G01/1R/1U/2/3/4 family of SGAs operates over this temperature range, but operation must not cause TJ to

exceed Maximum Junction Temperature (+150°C).

GSEL

VOUT

tGSL1

0.15V

1.50V

VIN

0.150V

0.030V

0.15V

tGSM10

0.03V

1.50V

tGSH1

0.03V

tGSM50

0.30V

1.50V

tGSH10

0.30V

tGSL50

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