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MCP4021 датащи(PDF) 57 Page - Microchip Technology |
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MCP4021 датащи(HTML) 57 Page - Microchip Technology |
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57 / 64 page ![]() © 2006 Microchip Technology Inc. DS21945E-page 57 MCP4021/2/3/4 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging L L1 ϕ c A2 A1 A b 2 1 NOTE 1 e E E1 D N Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width Units Dimension Limits N e A A2 A1 E E1 D L L1 ϕ c b — 0.75 0.00 0.40 0° 0.08 0.22 8 0.65 BSC — 0.85 — 4.90 BSC 3.00 BSC 3.00 BSC 0.60 0.95 REF — — — 1.10 0.95 0.15 0.80 8° 0.23 0.40 MIN NOM MAX MILLIMETERS Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04–111, Sept. 8, 2006 |
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