TDA8366H datasheet(16/48 Pages) PHILIPS

16 / 48 page

January 1995

Philips Semiconductors

Objective speciﬁcation

I2C-bus controlled PAL/NTSC TV

processor

TDA8366

Table 41 AFC output

AFA

AFB

CONDITION

outside window; too low

outside window; too high

in window; below reference

in window; above reference

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. All pins are protected against ESD by means of internal clamping diodes.

2. Human Body Model (HBM): R = 1.5 k

Ω; C = 100 pF.

3. Machine Model (MM): R = 0

Ω; C = 200 pF.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

−

9.0

Tstg

storage temperature

−25

+150

°C

Tamb

operating ambient temperature

°C

Tsol

soldering temperature

for 5 s

−

260

°C

operating junction temperature

−

150

°C

Ves

electrostatic handling

HBM; all pins; notes 1 and 2

−2000

+2000

MM; all pins; notes 1 and 3

−200

+200

SYMBOL

PARAMETER

VALUE

UNIT

Rth j-a

thermal resistance from junction to ambient in free air

SDIP52

K/W

QFP64

K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”. The number of the

quality specification can be found in the

“Quality

Reference Handbook”. The handbook can be ordered

using the code 9398 510 63011.

Latch-up

• I

trigger ≥ 100 mA or ≥1.5VDD(max)

• Itrigger ≤−100 mA or ≤−0.5VDD(max).

Following pins do not meet the above specification:

Pin 7:

−90 mA

Pin 17: 90 mA

Pin 18: 90 mA

Pin 19: 90 mA

Pin 24:

−90 mA

Pin 34: 60 mA

Pin 49:

−90 mA

Pin 50:

±90 mA.

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