February 1995

21

Philips Semiconductors

Preliminary specification

PAL/NTSC colour processor for

PIP applications

TDA8310

PACKAGE OUTLINE

Fig.4 Plastic shrink dual in-line package; 52 leads; 600 mil (SDIP52, SOT247-1).

Dimensions in mm.

handbook, full pagewidth

1

27

26

1.3 max

14.1

13.7

47.92

47.02

4.57

max

5.08

max

0.51

min

3.2

2.8

0.53

max

1.778

(25x)

1.73

max

15.80

15.24

0.32 max

15.24

17.15

15.90

MSA267

52

SOLDERING

Plastic dual in-line packages

The maximum permissible temperature of the solder is

260

°C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

Apply a low voltage soldering iron below the seating plane

(or not more than 2 mm above it). If its temperature is

below 300

°C, it must not be in contact for more than 10 s;

if between 300 and 400

°C, for not more than 5 s.