Data Sheet

ADN2913

Rev. B | Page 35 of 35

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

EXPOSED

PAD

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.20 REF

0.25 MIN

3.16 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.65

2.50 SQ

2.45

1

24

7

12

13

18

19

6

0.05 MAX

0.02 NOM

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 39. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering Quantity

ADN2913ACPZ

−40°C to +85°C

24-Lead LFCSP

CP-24-7

490

ADN2913ACPZ-RL7

−40°C to +85°C

24-Lead LFCSP, 7”Tape and Reel

CP-24-7

1500

EVALZ-ADN2913

Evaluation Board

1

Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

©2013–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D11777-0-8/17(B)