Preliminary PI3033B datasheet

PI3033B

200DPI CIS Sensor Chip

Engineering Data Sheet

Description

:

Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per

inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s

proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a

series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a

printed circuit board (PCB) in varying sensing array lengths. Accordingly offering image

reading widths to suit document scanners found in facsimile, scanner, check reader, and office

automation equipment.

Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector

elements, their associated multiplexing switches, buffers, and a chip selector. The detector's element-

to-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by

500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad

symbols and functions are described in Table 1.

Figure 1. PI3033B Block Diagram

SYMBOL

FUNCTION

SP

Start Pulse: Input to start the line scan.

CP

Clock Pulse: Input to clock the Shift Register.

VDD

Positive Supply: +5 volt supply connected to substrate.

DGND

Digital Ground: Connection topside common

RSTLEV

A Bias Pad: Not used, left floating

IOUT

Signal Current Output: Output for video signal current

AGND

Analog Ground: Connection topside common

EOS

End of Scan Pulse: Output from the shift register at end of scan.

Buffer

SP

CP

VDD DGND

IOUT

RSTLEV

AGND EOS

Chip

Select

Buffer

Readout Shift Register

Row of 64 Sensors

and Video Signal

Multiplexers

Buffer

7950

m

500

m

Table 1. Pad Symbols and Functions

Page 2 of 13 Date: 03/18/05