5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Any pin relative to V–

–0.3

6

V

Input voltage, IN+, IN–, OUT pins

V– – 0.3

V+ + 0.3

V

Input current, V+, V–, OUT pins

40

mA

Differential input voltage (VIN+ – VIN–)

–300

300

mV

TJ

Junction temperature(2)

–40

150

°C

Mounting temperature

Infrared or convection

(30s)

260

°C

Wave soldering

lead temperature (4s)

260

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature

is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a printed circuit board (PCB).

5.2 ESD Ratings

VALUE

UNIT

DCK (SC70) PACKAGE

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM) per JEDEC specification JESD22-C101(2)

±1000

Machine model

±200

P (PDIP) PACKAGE

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002(2)

±1000

Machine model

±200

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN

NOM

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

1.6

5.5

V

TA

Temperature(2)

–40

125

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Recommended Operating Conditions indicate conditions

for which the device is intended to be functional, but specific performance is not tested. For tested specifications and test conditions,

see Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature

is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PCB.

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LPV521

SNOSB14E – AUGUST 2009 – REVISED JULY 2024

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