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SL1ICS3001 датащи(PDF) 17 Page - NXP Semiconductors |
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SL1ICS3001 датащи(HTML) 17 Page - NXP Semiconductors |
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17 / 22 page ![]() I•CODE1 Chip Specification Rev. 2.1 May 2000 SL040521.doc/M Public Page 17 of 22 15 Inlet/Label Characterisation and Test 15.1 Characterisation of the Inlet/Label The parameters recommended to be characterised for the inlet/label are: Parameter Symbol Conditions Resonant frequency fres Resonant frequency @ Tamb = 22 °C @ BTH No command transmitted to the inlet/label à Label generates no response à No modulation Threshold value for UNSELECTED READ command (standard mode) BTH UNSELECTED READ command OK Threshold value for WRITE command (standard mode) BWR WRITE (and Verifying READ) command OK 15.2 Final Test of the Inlet/Label Basic flow for production and test: 1. Production of wafer 2. Testing of dies on wafer 3. Writing of serial numbers and pre-configuration 4. Sawing of wafer 5. Assembly of inlets/labels 6. Final test of inlets/labels 7. Writing of customer data To detect damage of EEPROM cells during production of inlets/labels a final test of the EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve lowest failure rates. |
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