I•CODE1 Chip Specification

Rev. 2.1

May 2000

SL040521.doc/M

Public

Page 13 of 22

10 Packing

The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and

electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips

‘General Specification for 6” Wafer (Prod. Spec.)’.

10.1 Storage Recommendations

Unsawn/sawn wafers should be kept in their original packing whilst in storage.

Recommended storage conditions:

Temperature:

15 ... 25 °C

Climate atmosphere:

Duration of storage:

max. 6 months

Deviating requirements have to be arranged between customer and Philips Semiconductors.

10.2 Possible Forms of Delivery

10.2.1 Packing of Unsawn Wafers

Delivery form:

wafer box

10.2.2 Packing of Sawn Wafers

Delivery form:

Film Frame Carrier (standard Philips carrier type P7)

Foil thickness:

0.55 ... 0.85 mm

Foil material:

sticky foil