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SST25WF080B датащи(PDF) 38 Page - Microchip Technology |
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SST25WF080B датащи(HTML) 38 Page - Microchip Technology |
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38 / 44 page ![]() SST25WF080B DS20005164H-page 38 2013-2022 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Y2 SILK SCREEN Y1 C X2 X1 Dimension Limits Units C Optional Center Pad Width Terminal Pad Spacing Optional Center Pad Length Terminal Pitch Y2 X2 1.70 0.30 MILLIMETERS 0.50 BSC MIN E MAX 2.80 Terminal Pad Length (X8) Terminal Pad Width (X8) Y1 X1 0.90 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2203B [PRX] NOM E G Mininum Between Terminal Pads G 0.20 8-Lead Plastic Ultra Thin Small Outline No Lead Package (PRX) - 2x3 mm Body [USON] [Also called UDFN] |
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