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LAN8804/ZMXC1 датащи(PDF) 82 Page - Microchip Technology |
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LAN8804/ZMXC1 датащи(HTML) 82 Page - Microchip Technology |
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82 / 91 page ![]() LAN8804 DS00003591G-page 82 © 2024 Microchip Technology Inc. and its subsidiaries FIGURE 7-2: 128-TQFP PACKAGE (DIMENSIONS) REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 SECTION A-A L1 L H 3 2 1 R R1 Microchip Technology Drawing C04-181 Rev A c Molded Package Thickness Dimension Limits Mold Draft Angle Top Foot Length Lead Width Molded Package Length Molded Package Width Overall Length Overall Width Foot Angle Footprint Standoff Overall Height Lead Pitch Number of Leads 0.75 0.60 0.45 L 0.16 14.00 BSC 14.00 BSC 16.00 BSC 16.00 BSC - 1.00 REF b D1 E1 0.13 D E L1 0° 0.23 7° 1.00 0.40 BSC 128 NOM MILLIMETERS A1 A2 A e 0.05 0.95 - Units N MIN 1.05 0.15 1.20 0.10 - MAX Lead Bend Radius 0.08 - - Lead Bend Radius 0.08 0.20 - R R1 Exposed Pad Length D2 9.00 8.90 9.10 Exposed Pad Width E2 Mold Draft Angle Bottom 11° 13° 12° 3 2 Lead Angle 0° - - 1 9.00 8.90 9.10 11° 13° 12° Lead Thickness - c 0.09 0.20 |
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