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MPC826XACVR датащи(PDF) 12 Page - Freescale Semiconductor, Inc |
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MPC826XACVR датащи(HTML) 12 Page - Freescale Semiconductor, Inc |
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12 / 52 page ![]() MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 12 Freescale Semiconductor Electrical and Thermal Characteristics 2.2 Thermal Characteristics Table 4 describes thermal characteristics. 2.3 Power Considerations The average chip-junction temperature, TJ, in °C can be obtained from the following: TJ = TA + (PD x θJA) (1) where TA = ambient temperature °C θ JA = package thermal resistance, junction to ambient, °C/W PD = PINT + PI/O PINT = IDD x VDD Watts (chip internal power) PI/O = power dissipation on input and output pins (determined by user) For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ is the following: Notes: 1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 2. The leakage current is measured for nominal VDD, VCCSYN, and VDD. 3. MPC8265 and MPC8266 only. Table 4. Thermal Characteristics for 480 TBGA Package Characteristics Symbol Value Unit Air Flow Junction to ambient θJA 13(1) Notes: 1. Assumes a single layer board with no thermal vias °C/W NC(2) 2. Natural convection 101 1 m/s 11(3) 3. Assumes a four layer board NC 83 1 m/s Junction to board(4) 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. θJB 4 °C/W — Junction to case(5) 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). θJC 1.1 °C/W — |
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