D

S

G

Absolute Maximum Ratings TA = 25

unless otherwise noted

Symbol

Rating

Unit

VDS

30

VGS

±8

Continuous Drain Current

ID

2.2

IDM

10

(Note 1a)

0.5

(Note 1b)

0.46

Thermal Resistance.Junction- to-Ambient

(Note 1a)

RthJA

250

Thermal Resistance.Junction- to-Case

(Note 1)

RthJC

75

TJ

150

Tstg

-55 to 150

Notes:

1. R JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is

defined as the solder mounting surface of the drain pins. R JC is guaranteed by design while R CA is determined by

the user's board design.

a. 250

/W when mounted on a 0.02 in

2 pad of 2oz Cu.

c. 270

/W when mounted on a 0.001in

2 pad of 2oz Cu.

Junction Temperature

Storage Temperature Range

PD

W

Power Dissipation

/W

V

A

Pulsed Drain Current

Parameter

Drain-Source Voltage

Gate-Source Voltage

Features

VDS (V) =30 V

ID = 2.2 A

RDS(ON) = 0.065

@ VGS = 4.5 V

RDS(ON) = 0.082

@ VGS = 2.5 V

FDN337N

N-Channel MOSFET

1

2

3

■

Simplified outline(SOT-23)

1. Gate

2. Source

3. Drain

1

Rev:2022A2