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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD8156ABCZ датащи(PDF) 3 Page - Analog Devices |
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AD8156ABCZ датащи(HTML) 3 Page - Analog Devices |
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3 / 20 page  AD8156 Rev. 0 | Page 3 of 20 SPECIFICATIONS ELECTRICAL SPECIFICATIONS VTTI = VTTO = VCC = 3.3 V, VEE = 0 V, RL = 50 Ω, differential output swing = 800 mV, ac-coupled, data rate = 6.25 Gbps, PRBS 223−1, VIN = 1 V p-p differential, TA = 25°C, unless otherwise noted. Table 1. Parameter Symbol Conditions Min Typ Max Unit DYNAMIC PERFORMANCE Maximum Data Rate NRZ data 6.25 Gbps Deterministic Jitter Data date < 6.25 Gbps 25 ps p-p Random Jitter 0.8 ps rms Propagation Delay tPD Input to output 1000 ps Propagation Delay Match 50 ps Output Fall Time tF Differential, 20% to 80% 75 ps Output Rise Time tR Differential, 20% to 80% 75 ps INPUT CHARACTERISTICS Input Voltage Swing VIN Differential 200 2000 mV p-p Input Voltage Range Single-ended VEE + 1.5 VCC V Input Voltage Range VCM Common-mode VEE + 1.6 VCC V Input Termination RIN Single-ended 50 Ω OUTPUT CHARACTERISTICS Output Voltage Swing VOUT Differential, programmable 50 800 1850 mV p-p Output Voltage Range Common-mode VEE + 1.6 VCC V Output Termination ROUT Single-ended 50 Ω POWER SUPPLY VCC Operating Range VCC VEE = 0 V 3.0 3.3 3.6 V Supply Current ICC1 All disabled 19 mA ICC1 All outputs on, no equalization 67 mA ICC1 All outputs and equalizers on 141 mA ITTI 800 mV differential swing 32 mA ITTO 800 mV differential swing 32 mA Power Dissipation2 All disabled 60 mW All outputs on, no equalization 400 mW All outputs and equalizers on 700 mW THERMAL CHARACTERISTICS Operating Temperature Range −40 85 °C LOGIC INPUT CHARACTERISTICS VCC = 3.3 V dc Input VIN High 2.0 VCC V Input VIN Low 0 0.8 V 1 ICC supply current excludes input and output termination currents. Currents at VTTI and VTTO count in power dissipation, but are not included in ICC. Note that in a CML output structure with separate termination supplies, all of the output and input current is drawn from VTTI and the termination resistors, not from Vcc. 2 Power dissipation includes power due to 800 mV p-p differential input and output voltages; this is the true representation of power dissipated on and used by the chip at an 800 mV p-p differential signal level. |
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