TSL2581FN datasheet(46/53 Pages) OSRAM

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ams Datasheet

Page 45

[v1-00] 2016-Apr-05

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TSL2580, TSL2581 − Manufacturing Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package

molding compound. To ensure the package molding

compound contains the smallest amount of absorbed moisture

possible, each device is dry-baked prior to being packed for

shipping. Devices are packed in a sealed aluminized envelope

with silica gel to protect them from ambient moisture during

shipping, handling, and storage before use.

CS Package

The CS package has been assigned a moisture sensitivity level

of MSL 2 and the devices should be stored under the following

conditions:

• Temperature Range: 5ºC to 50ºC

• Relative Humidity: 60% maximum

• Floor Life: 1 year out of bag at ambient < 30°C / 60% RH

Rebaking will be required if the aluminized envelope has been

open for more than 1 year. If rebaking is required, it should be

done at 90ºC for 3 hours.

FN Package

The FN package has been assigned a moisture sensitivity level

of MSL 3 and the devices should be stored under the following

conditions:

• Temperature Range: 5ºC to 50ºC

• Relative Humidity: 60% maximum

• Total Time: 6 months from the date code on the

aluminized envelope — if unopened

• Opened Time: 168 hours or fewer

Rebaking will be required if the devices have been stored

unopened for more than 6 months or if the aluminized envelope

has been open for more than 168 hours. If rebaking is required,

it should be done at 90ºC for 4 hours.

TSL2581FN датащи(PDF) 46 Page - OSRAM GmbH