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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TSL2581FN датащи(PDF) 41 Page - OSRAM GmbH |
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TSL2581FN датащи(HTML) 41 Page - OSRAM GmbH |
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41 / 53 page  Page 40 ams Datasheet Document Feedback [v1-00] 2016-Apr-05 TSL2580, TSL2581 − Mechanical Data Figure 43: Package CS — Six-Lead Chipscale Packaging Configuration Note(s): 1. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted. 2. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%). 3. The top of the photodiode active area is 410 μm below the top surface of the package. 4. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. 5. This drawing is subject to change without notice. Mechanical Data PACKAGE CS Six-Lead Chipscale Device 1250 6 y 100 400 + 50 700 + 55 TYP 30 5 500 500 375 + 30 500 375 + 30 1750 TOP VIEW SIDE VIEW BOTTOM VIEW END VIEW 6 y j 210 + 30 1 2 3 6 5 4 PIN OUT BOTTOM VIEW Lead Free Pb Green RoHS |
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